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NEWSUS patent for on-chip fractal antenna
"Fractus, the pioneer developer of fractal antenna technology, has been granted the world's first technology patent for an integrated circuit package including a miniature fractal antenna. The technology, commonly referred to as Antenna in Package (AiP), has been granted in the US under patent #7095372. "Fractus technology allows the antenna, traditionally a separate component, to be integrated with other RF components such as the radio and RF processor. Using fractal geometry with its extremely economical use of space, Fractus has created a solution that is small enough to be incorporated onto the IC (Integrated Circuit) and accommodate multiple bands (frequencies) to support numerous short-range wireless standards... "AiP reduces the bill of materials, component size, motherboard complexity, design cost and time to market for devices where wireless capability already exists such as mobile handsets. It also facilitates the implementation of discrete wireless functions within mobile devices such as mobile phones, digital cameras, MP3 players and other myriad devices using short-range wireless technologies. AiP technology is suitable for Bluetooth, WLAN, GPS, UWB and Zigbee..." [Wireless: 5 October 2006] |
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